Semiconductor package and method of manufacturing the same

ABSTRACT

A light-emitting device package including a lead frame formed of a metal and on which a light-emitting device chip is mounted; and a mold frame coupled to the lead frame by injection molding. The lead frame includes: a mounting portion on which the light-emitting device chip is mounted; and first and second connection portions that are disposed on two sides of the mounting portion in a first direction and connected to the light-emitting device chip by wire bonding, wherein the first connection portion is stepped with respect to the mounting portion, and a stepped amount is less than a material thickness of the lead frame.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of Korean Patent Application No.10-2010-0131667, filed on Dec. 21, 2010, in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein in itsentirety by reference.

BACKGROUND

1. Field

The present disclosure relates to light-emitting device packages inwhich a light-emitting device chip is packaged using a lead frame and amold, and methods of manufacturing the light-emitting device packages.

2. Description of the Related Art

Light-emitting device chips such as light-emitting diodes (LED) refer tosemiconductor devices capable of reproducing various colors of light byincluding a light-emitting source via PN junctions of a compoundsemiconductor. A LED has a long lifetime, is compact and lightweight,and has an intense light directivity and can be driven at a relativelylow voltage. Also, a LED is resistant to impact and vibration, does notrequire a preheating time or complicated driving operations, and can bepackaged in various forms. Thus, the LED may be used for variouspurposes.

A light-emitting device chip like a LED is mounted in a metal lead frameand a mold frame through a packaging operation to be manufactured as asemiconductor.

SUMMARY

Provided are light-emitting device packages in which a mold frame and alead frame are firmly coupled to each other, and methods ofmanufacturing the light-emitting device packages.

Provided are light-emitting device packages in which a uniform lightflux may be maintained, and methods of manufacturing the light-emittingdevice packages.

Provided are light-emitting device packages in which a mold frame and alead frame are firmly coupled to each other and a light-emittingefficiency is high, and methods of manufacturing the light-emittingdevice packages.

Provided are light-emitting device packages in which a mold frame and alead frame are firmly coupled to each other and the total thicknesses ofthe light-emitting device packages may be reduced, and methods ofmanufacturing the light-emitting device packages.

Provided are light-emitting device packages in which deformation ofwires connected to a light-emitting chip and risk of breaks of the wiresmay be reduced, and methods of manufacturing the light-emitting devicepackages.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to an aspect of the present invention, a light-emitting devicepackage includes: a lead frame formed of a meal and on which alight-emitting device chip is mounted; and a mold frame coupled to thelead frame by injection molding, wherein the lead frame includes: amounting portion on which the light-emitting device chip is mounted; andfirst and second connection portions that are disposed on two sides ofthe mounting portion in a first direction and connected to thelight-emitting device chip by wire bonding, wherein the first connectionportion is stepped with respect to the mounting portion, and a steppedamount is less than a material thickness of the lead frame.

The second connection portion is stepped with respect to the mountingportion, and a stepped amount is less than the material thickness of thelead frame.

The light-emitting device package may further include a first reflectionportion that reflects light emitted from the light-emitting device chipand is disposed on two sides of the mounting portion in a seconddirection that is perpendicular to the first direction. An inclinationangle of the first reflection portion to the mounting portion may befrom about 30 to about 60 degrees. A height of the first reflectionportion may be from about 0.5 to about 1.5 times the material thicknessof the lead frame. A length of the first reflection portion in the firstdirection may be longer than a length of the light-emitting device chip.

The mounting portion may be rectangular, and the second direction is ashort axis direction. The mold frame may include a second reflectionportion that reflects light emitted from the light-emitting device chipand is disposed on two sides of the mounting portion in the firstdirection. The mold frame may be formed of a liquid crystal polymer(LCP).

According to another aspect of the present invention, a light-emittingdevice package includes: a light-emitting device chip; a mountingportion that is rectangular and on which the light-emitting device chipis mounted; a first reflection portion that is made of a metal anddisposed on two sides of the mounting portion in a short axis directionand reflects light emitted from the light-emitting device chip; and asecond reflection portion that is made of a metal and is disposed on twosides of the mounting portion in a long axis direction and reflectslight emitted from the light-emitting device chip.

An inclination angle of the first reflection portion to the mountingportion may be from about 30 to about 60 degrees.

A height of the first reflection portion may be from about 0.5 to about1.5 times a thickness of the mounting portion.

The length of the first reflection portion along the long axis may belonger than a length of the light-emitting device chip.

The mold may be formed of a liquid crystal polymer (LCP).

The light-emitting device package may further include first and secondconnection portions that are disposed on two sides of the mountingportion in a short axis direction and connected to the light-emittingdevice chip by wire bonding, wherein at least one of the first andsecond connection portions is spaced apart from the mounting portion inthe long axis direction, and is stepped with respect to the mountingportion, and a stepped amount is equal to or less than a materialthickness of the lead frame.

According to another aspect of the present invention, a method ofmanufacturing a light-emitting device package, includes: forming a leadframe by processing a metal plate, the lead frame including a mountingportion, first and second connection portions that are disposed on twosides of the mounting portion in a first direction and respectivelyconnected to the metal plate via first and second support arms, and afirst reflection surface that is extended from two boundaries of themounting portion in a second direction that is perpendicular to thefirst direction and is connected to the metal plate via a third supportarm; forming a mold frame by performing an injection molding process toa polymer on the lead frame to couple the lead frame and the mold frameto each other, wherein the mold frame includes a second reflectionsurface disposed on two sides of the mounting portion in the firstdirection; mounting a light-emitting device chip on the mountingportion; and electrically connecting the light-emitting device chip andthe first and second connection portion by wire bonding after cuttingthe first and second support arms.

The method may further include: filling an upper portion of thelight-emitting chip with a transmissive filler to form a light-emittingdevice package; and separating the light-emitting device package fromthe metal plate by cutting the third support arm.

The polymer may include a liquid crystal polymer (LCP). Thelight-emitting device package may be rectangular, and the seconddirection may be a short axis direction.

At least one of the first and second connection portions may be spacedapart from the mounting portion. At least one of the first and secondconnection portions may be stepped upward with respect to the mountingportion. A stepped amount may be equal to or less than a materialthickness of the lead frame. An inclination angle of the firstreflection portion to the mounting portion may be from about 30 to about60 degrees. A height of the first reflection portion may be from about0.5 to about 1.5 times a material thickness of the lead frame. A lengthof the first reflection portion in the first direction may be longerthan a length of the light-emitting device chip.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings of which:

FIG. 1 is a perspective view illustrating a light-emitting devicepackage according to an embodiment of the present invention;

FIG. 2 is a cross-sectional view of the light-emitting device package ofFIG. 1, cut along a line A-A, according to an embodiment of the presentinvention;

FIG. 3 is a cross-sectional view of the light-emitting device package ofFIG. 1, cut along a line B-B, according to an embodiment of the presentinvention;

FIG. 4 is a cross-sectional view illustrating a light-emitting devicepackage according to another embodiment of the present invention;

FIG. 5 is a cross-sectional view illustrating a light-emitting devicepackage according to another embodiment of the present invention;

FIG. 6 is a plan view illustrating a method of forming a lead frame froma metal plate, according to an embodiment of the present invention;

FIG. 7 is a plan view illustrating a lead frame to which a mold frame iscoupled, according to an embodiment of the present invention;

FIG. 8 is a plan view illustrating first and second support arms, whichconnect first and second connection portions and a metal plate, that arecut, according to an embodiment of the present invention;

FIG. 9 is a plan view illustrating a light-emitting device package inwhich a light-emitting device chip is mounted in a mounting portion anda wire bonding operation is performed, according to an embodiment of thepresent invention;

FIG. 10 is a plan view illustrating a cavity of a light-emitting devicepackage in which a filler is filled, according to an embodiment of thepresent invention; and

FIG. 11 is a plan view illustrating a light-emitting device packageseparated from the metal plate by cutting a third support arm, accordingto an embodiment of the present invention.

DETAILED DESCRIPTION

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings, wherein like referencenumerals refer to the like elements throughout. In this regard, thepresent embodiments may have different forms and should not be construedas being limited to the descriptions set forth herein. Accordingly, theembodiments are merely described below, by referring to the figures, toexplain aspects of the present description.

FIG. 1 is a perspective view illustrating a light-emitting devicepackage 1 according to an embodiment of the present invention. FIG. 2 isa cross-sectional view of the light-emitting device package 1 of FIG. 1,cut along a line A-A, according to an embodiment of the presentinvention. FIG. 3 is a cross-sectional view of the light-emitting devicepackage 1 of FIG. 1, cut along a line B-B, according to an embodiment ofthe present invention.

Referring to FIGS. 1 through 3, the light-emitting device package 1includes a mold frame 100 and a lead frame 200 formed of a metal. Alight-emitting device chip 300 is mounted in the lead frame 200.

The light-emitting device chip 300 may be a light-emitting diode chip.The light-emitting diode chip may emit blue, green, or red color lightaccording to the material of a compound semiconductor of which thelight-emitting diode chip is formed. Also, a surface of thelight-emitting diode chip may be coated with a fluorescent material soas to emit white light. For example, a blue light-emitting diode chipmay include an active layer having a plurality of quantum well layersthat are formed by alternately stacking GaN and InGaN, and a P-type cladlayer and an N-type clad layer formed of a compound semiconductor ofAl_(x)Ga_(y)N_(z) may be formed respectively on and under the activelayer. In the current embodiment, a light-emitting diode chip is used asthe light-emitting device chip 300 but the embodiment of the presentinvention is not limited thereto. For example, the light-emitting devicechip 300 may be a UV photodiode chip, a laser diode chip, an organiclight-emitting diode chip, or the like.

The lead frame 200 includes a mounting portion 210 on which thelight-emitting device chip 300 is mounted, first and second connectionportions 220 and 230 that are electrically connected to thelight-emitting device chip 300 by wire bonding, and a first reflectionportion 240 reflecting light that is emitted by the light-emittingdevice chip 300 to emit the light out of the light-emitting devicepackage 1. The first and second connection portions 220 and 230 arelocated on two sides of the mounting portion 210 in a first directionD1. For example, the first and second connection portions 220 and 230may be connected to a cathode electrode and an anode electrode of thelight-emitting device chip 300 via wires 301 and 302, respectively. Thefirst and second connection portions 220 and 230 are exposed out of themold frame 100 and function as terminals that supply a current to thelight-emitting device chip 300. The first reflection portion 240 islocated along a second direction D2 that is perpendicular to the firstdirection D1. The lead frame 200 may be manufactured by pressing oretching a metal plate such as aluminum, copper, or the like.

The mold frame 100 may be coupled to the lead frame 200 using, forexample, an insert injection molding method. The mold frame 100 may beformed of, for example, an electrical insulating polymer. The mold frame100 is formed to have a cavity form in which the mounting portion 210,the first and second connection portions 220 and 230, and the firstreflection portion 240 are exposed. The mold frame 100 includes a secondreflection portion 101 that reflects light emitted from thelight-emitting device chip 300 so as to be emitted from thelight-emitting device package 1. The second reflection portion 101 isdisposed on two sides of the mounting portion 210 along the firstdirection D1. In addition, an inner side 102 of the mold frame 100 inthe second direction D2, except the first reflection portion 240,functions as a reflection portion for reflecting light. Accordingly, inthe light-emitting device package 1, the light-emitting device chip 300is disposed on a lower surface of a cavity 2 that is entirely concave,and the first reflection portion 240 corresponding to an inner side ofthe cavity 2 and the inner side 102 function as a reflection portionthat reflects light so as to emit the light out of the light-emittingdevice package 1. A lower surface of the mounting portion 210 and thefirst and second connection portions 220 and 230 of the lead frame 200may be exposed downward from the mold frame 100 and function as a heatradiation surface.

As described above, the light-emitting device package 1 is manufacturedby coupling the mold frame 100 to the lead frame 200, and electricallyconnecting the light-emitting device chip 300 and the first and secondconnection portions 220 and 230 by wire bonding, and then byencapsulating the cavity 2 by filling the same with a transmissivefiller such as silicon. According to necessity, an upper portion orupper and lateral portions of the light-emitting device chip 300 may becoated with a fluorescent material before filling a filler.

In order to increase a coupling intensity between the lead frame 200 andthe mold frame 100, the first connection portion 220 and/or the secondconnection portion 230 are separably formed from the mounting portion210 and a polymer may be filled in a gap between the first and secondconnection portions 220 and 230. Referring to FIG. 2, the firstconnection portion 220 is disposed apart from the mounting portion 210by a gap G1. Also, the first connection portion 220 is stepped upwardfrom the mounting portion 210. Accordingly, polymer, which is thematerial of the mold frame 100, is filled up to an inner portion 310corresponding to the gap G1 and a stepped space 311 under the firstconnection portion 220, thereby coupling the lead frame 200 and the moldframe 100 more firmly.

A length of the wire 301 needs to be longer than a distance between thecathode electrode of the light-emitting device chip 300 and the firstconnection portion 220, and the wire 301 curves in an upward direction.When the first connection portion 220 is stepped upward from themounting portion 210, a tip of the curve portion of the wire 301 isfurther raised. A thickness H of the light-emitting device package 1needs to be thick enough to completely accommodate the wire 301 withinthe light-emitting device package 1. The greater a stepped amount S1 ofthe first connection portion 220 with respect to the mounting portion210, the thicker the thickness H of the light-emitting device package 1and the higher a height H2 from the mounting portion 210 to an upperportion of the light-emitting device package 1. The higher the heightH2, the lower the light-emitting efficiency of light emitted from thelight-emitting device chip 300.

Table 1 shows results of analyzing a relationship between a light fluxand the height H2 from the mounting portion 210 to the upper portion ofthe light-emitting device package 1. L1 and L2 refer to a long axis anda short axis of the rectangular light-emitting device package 1, and Hrefers to the total height of the light-emitting device package 1. FLrefers to a ratio of emissive light flux to a reference light flux.Here, light flux of Sample No. 1 is set as the reference light flux.

TABLE 1 No L1 (mm) L2 (mm) H (mm) H2 (mm) FL (%) 1 (ref) 4 2 0.85 0.55100 2 3 2 0.85 0.55 97.1 3 4 1.8 0.85 0.55 97.9 4 3 1.8 0.85 0.55 95.1 54 2 1 0.7 98.9 6 3 1.8 1 0.7 93.1

Comparing Samples 1 and 5 and Samples 4 and 6 of Table 1, when the longaxis L1 and the short axis L2 are the same, the lower the height H2 fromthe mounting portion 210 to the upper portion of the light-emittingdevice package 1, more light flux is emitted.

According to the current embodiment of the present invention, thestepped amount S1 of the first connection portion 220 with respect tothe mounting portion 210 is equal to or less than a material thickness Sof the lead frame 200. For example, when the stepped amount S1 is halfof the material thickness S, a height of the wire 301 may be smallerthan when the stepped amount S1 is the same as the material thickness S.As described above, by adjusting the stepped amount S1 of the firstconnection portion 220 to be less than the material thickness S1 of thelead frame 200 and firmly coupling the lead frame 200 and the mold frame100, the total height H of the light-emitting device package 1 may bereduced and the light-emitting efficiency may be improved.

Referring to FIG. 4, the second connection portion 230 may be spacedapart from the mounting portion 210 in the first direction D1 by a gapG2. According to the above-described configuration, a polymer, which themold frame 100 is formed of, is filled in an inner portion 320 of thegap G2 as illustrated in FIG. 4, thereby coupling the lead frame 200 andthe mold frame 100 more firmly.

Referring to FIG. 5, the second connection portion 230 is spaced apartfrom the mounting portion 210 in the first direction D1 by the gap G2,and may be stepped upward with respect to the mounting portion 210.According to the above-described configuration, the polymer of the moldframe 100 may be filled in the inner portion 320 of the gap G2 and astepped space 321 under the second connection portion 230 so that thelead frame 200 and the mold frame 100 may be coupled to each other morefirmly. In order to reduce space occupied by the wire 302, a steppedamount S2 of the second connection portion 230 may be adjusted to beless than a material thickness S of the lead frame 200.

Light emitted from the light-emitting device chip 300 is reflected bythe first and second reflection portions 240 and 101 and the inner side102 along the second direction D2, except the first and secondreflection portions 240 of the mold frame 100, and is emitted out of thelight-emitting device package 1. The polymer, which the mold frame 100is formed of, discolors if continuously exposed to light and heatirradiated from the light-emitting device chip 300, and may changechromaticity of light that is being reflected, thereby degrading lightquality.

Comparing Samples 1 and 3 and Samples 2 and 4 of Table 1, respectively,when the long axis L1 and the height H2 from the mounting portion 210 tothe upper portion of the light-emitting device package 1 are the same,the shorter the short axis L2, the more light flux is emitted. Thisindicates that more light flux may be incident on an inner side of thelight-emitting device package 1 in a short axis direction.

According to the current embodiment, a portion of the inner side of therectangular light-emitting device package 1 that is disposed along thesecond direction D2 where more light flux is incident due to theproximity to the light-emitting device chip 300 is formed by using thelead frame 200. That is, the first reflection portion 240, which isformed of a metal, is disposed along the short axis direction of thelight-emitting device chip 300. Since the first reflection portion 240is formed of a metal, properties of the first reflection portion 240such as discoloration change relatively small compared to a polymer.Accordingly, the light-emitting device package 1 capable of emittinglight of uniform quality over a long period of time may be implemented.

The first reflection portion 240 may be bent in an upward direction froma boundary of the mounting portion 210 at an angle in the short axisdirection. The first reflection portion 240 may have a length that issufficient to cover a length of the light-emitting device chip 300 in along axis direction. In other words, a length of the first reflectionportion 240 in the long axis direction may be equal to or greater thanthat of the light-emitting device chip 300 in the long axis direction.An angle to the mounting portion 210 of the first reflection portion 240may be from about 30 to about 60 degrees. When a height H3 of the firstreflection portion 240 is too high, the light-emitting efficiency israther decreased, and when the height H3 is too low, the reflectioneffects are reduced. Considering this, the height H3 of the firstreflection portion 240 may be set as 0.5 to 1.5 times of the materialthickness S of the lead frame 200.

The light-emitting efficiency may also be increased by forming areflection portion also in the long axis direction of the light-emittingdevice package 1. When forming a reflection portion by bending the leadframe 200, the lead frame 200 needs to be bent from the first and secondconnection portions 220 and 230, which makes the structure of the leadframe 200 complicated. According to the light-emitting device package 1,the second reflection portion 101 is formed as a portion of the moldframe 100 on two sides in the long axis direction. Since the secondreflection portion 101 is disposed relatively away from thelight-emitting device chip 300 compared to the first reflection portion240 disposed along the short axis direction, the second reflectionportion 101 is less affected by light and heat emitted from thelight-emitting device chip 300. Also, the inner side 102 of the moldframe 100 in the short axis direction is also disposed away from thelight-emitting device chip 300 and thus is less affected by light andheat emitted from the light-emitting device chip 300. By forming themold frame 100 using a liquid crystal polymer (LCP), which is resistantto heat, deterioration of light quality due to discoloration of theinner side 102 of the mold frame 100 in the short axis direction and thesecond reflection portion 101 may be reduced.

Hereinafter, a method of manufacturing a light-emitting device packageaccording to an embodiment of the present invention will be described.

(1) Molding of Lead Frame

Referring to FIG. 6, a metal plate 400 such as aluminum or copper ispressed or etched, etc. to form the mounting portion 210, the first andsecond connection portions 220 and 230, and the first reflection portion240.

The first reflection portion 240 is formed by bending the moldingportion 210 up about a boundary thereof along the first direction D1 atan angle in an upward direction. As described above, a length of thefirst reflection portion 240 in a long axis direction may be equal to orgreater than a length of the light-emitting device chip 300 in the longaxis direction. An inclination angle (C in FIG. 3) of the firstreflection portion 240 with respect to the mounting portion 210 may be30 to 60 degrees, and the height H3 of the first reflection portion 240may be set as 0.5 to 1.5 times of the material thickness S1 of the leadframe 200.

As illustrated in FIG. 2, the first connection portion 220 may be spacedapart from the mounting portion 210 in the first direction D1 by the gapG1. Also, the first connection portion 220 may be stepped with respectto the mounting portion 210 by an amount corresponding to the materialthickness S or less of the lead frame 200.

The second connection portion 230 is disposed opposite to the firstconnection portion 220 with the mounting portion 210 therebetween. Asillustrated in FIG. 2, the second connection portion 220 may be formedby extending from the mounting portion 210. Alternatively, the secondconnection portion 220 may be spaced apart from the mounting portion 210by the gap G2, as illustrated in FIG. 4. Alternatively, the secondconnection portion 220 may be stepped with respect to the mountingportion 210 by an amount corresponding to the material thickness S ofthe lead frame 200 or less as illustrated in FIG. 5.

In order to maintain the lead frame 200 connected to the metal plate 400before performing an injection molding process which will be describedbelow, the first and second connection portions 220 and 230 are formedso as to be connected to the metal plate 400 via first and secondsupport arms 221 and 231, respectively. The first reflection portion 240is connected to the metal plate 400 via a third support arm 241. Awashing operation for removing foreign materials from the lead frame 200may be performed before an injection molding process. In addition, aplating operation may be performed for surface treatment of the leadframe 200.

(2) Molding a Mold Frame

Next, the mold frame 100 is coupled to the lead frame 200. The moldframe 100 may be formed by performing injection molding such as aninsert injection molding operation to a polymer such as phenyl propanolamide (PPA), a liquid crystal polymer (LCP), or the like. When LCP isused as a polymer, discoloration possibilities due to light and heatemitted from the light-emitting device chip 300 may be reduced as muchas possible to maintain a uniform light quality. For example, the metalplate 400 on which the lead frame 200 is formed is inserted into a moldhaving a structure in which a form of the mold frame 100 illustrated inFIGS. 1 through 5 is engraved and the mounting portion 210, the firstand second connection portions 220 and 230, and the first reflectionportion 240 may be exposed, and a polymer is injected into the mold andsolidified. Then, as illustrated in FIG. 7, a coupled structure 410 inwhich the mold frame 100 is coupled to the lead frame 200 ismanufactured. Since the first through third support arms 221, 231, and241 are connected to the metal plate 400 through the mold frame 100, thecoupled structure 410 is also connected to the metal plate 400.

(3) First Trimming

Next, a first trimming operation is performed. As illustrated in FIG. 8,the first and second support arms 221 and 231 respectively connectingthe first and second connection portions 220 and 230 to the metal plate400 are cut to separate the first and second connection portions 220 and230 from the metal plate 400. The third support arm 241 is connected tothe metal plate 400, and thus the coupled structure 410 is stillconnected to the metal plate 400.

(4) Mounting and Wire Bonding of Light-Emitting Device Chip

Next, as illustrated in FIG. 9, the light-emitting device chip 300 ismounted in the mounting portion 210. The light-emitting device chip 300may be attached to the mounting portion 210 using, for example, anadhesive. Then, the wires 301 and 302 are used to respectively connectthe first and second connection portions 220 and 230 to a cathodeelectrode and an anode electrode of the light-emitting device chip 300.

(5) Filling Operation

Next, as illustrated in FIG. 10, an encapsulation operation of fillingthe cavity 2 with a transmissive filler such as silicon may beperformed. According to necessity, an upper portion or upper and lateralportions of the light-emitting device chip 300 may be coated with afluorescent material before filling the filler. Alternatively andobviously, the light-emitting device chip 300, an upper portion or upperand lateral portions of which are coated with a fluorescent material inadvance, may be mounted in the mounting portion 210.

(6) Separation

Next, as illustrated in FIG. 11, the light-emitting device package 1 isseparated from the metal plate 400 by cutting the third support arm 241to complete the manufacture of the light-emitting device package 1.

In the first trimming operation, stress applied to the first and secondsupport arms 221 and 231 may be transferred to the mold frame 100 andthe lead frame 200. Since the first and second support arms 221 and 231,which are disposed in the same direction as a wire bonding direction,that is, in the long axis direction, are cut in the first trimmingoperation, the mold frame 100 and the lead frame 200 may deform in thelong axis direction temporarily and/or permanently by the stress appliedto the first and second support arms 221 and 231. When the firsttrimming operation of separating the first and second connectionportions 220 and 230 from the metal plate 400 is performed after wirebonding, the wires 301 and 302 may deform or break due to deformation ofthe mold frame 100 and the lead frame 200 in the long axis direction. Inparticular, when the first and second connection portions 220 and 230are respectively spaced apart from the mounting portion 210 by the gapsG1 and G2, the first and second connection portions 220 and 230 are morelikely to deform in the first trimming operation, and the possibilitiesof deformation or break of the wires 301 and 302 may further increase.Thus, in the method of manufacturing a light-emitting device package,according to the current embodiment of the present invention, the firsttrimming operation of separating the first and second connectionportions 220 and 230 from the metal plate 400 is performed beforeperforming a wire bonding operation.

A second trimming operation of cutting the third support arm 241 afterthe wire bonding operation is an operation of cutting the third supportarm 241 disposed in the short axis direction, which is a directionperpendicular to the wire bonding direction. Thus, even when the moldframe 100 and the lead frame 200 partially deform, the deformationaffects the wires 301 and 302 less than in the first trimming operation.

As described above, in the method of manufacturing a light-emittingdevice package, according to the current embodiment of the presentinvention, a trimming operation of separating the light-emitting devicepackage 1 from the metal plate 400 is divided into the first trimmingoperation and the second trimming operation. The first trimmingoperation of cutting the first and second support arms 221 and 231 inthe same direction as the wire bonding direction is performed before awire bonding operation, and the second trimming operation of cutting thethird support arm 241 in a direction perpendicular to the wire bondingdirection is performed after a wire bonding operation. Accordingly, thepossibilities of deformation or break of the wires 301 and 302 in thetrimming operations may be reduced.

It should be understood that the exemplary embodiments described thereinshould be considered in a descriptive sense only and not for purposes oflimitation. Descriptions of features or aspects within each embodimentshould typically be considered as available for other similar featuresor aspects in other embodiments.

1-15. (canceled)
 16. A method of manufacturing a light-emitting devicepackage, the method comprising: forming a lead frame by processing ametal plate, the lead frame comprising a mounting portion, first andsecond connection portions that are disposed on two sides of themounting portion in a first direction and respectively connected to themetal plate via first and second support arms, and a first reflectionsurface that is extended from two boundaries of the mounting portion ina second direction that is perpendicular to the first direction and isconnected to the metal plate via a third support arm; forming a moldframe by performing an injection molding process to a polymer on thelead frame to couple the lead frame and the mold frame to each other,wherein the mold frame comprises a second reflection surface disposed ontwo sides of the mounting portion in the first direction; mounting alight-emitting device chip on the mounting portion; and electricallyconnecting the light-emitting device chip and the first and secondconnection portion by wire bonding after cutting the first and secondsupport arms.
 17. The method of claim 16, further comprising: filling anupper portion of the light-emitting chip with a transmissive filler toform a light-emitting device package; and separating the light-emittingdevice package from the metal plate by cutting the third support arm.18. The method of claim 10, wherein the polymer comprises a liquidcrystal polymer (LCP).
 19. The method of claim 16, wherein thelight-emitting device package is rectangular, and the second directionis a short axis direction.
 20. The method of claim 19, wherein at leastone of the first and second connection portions is spaced apart from themounting portion.
 21. The method of claim 20, wherein at least one ofthe first and second connection portions is stepped upward with respectto the mounting portion.
 22. The method of claim 21, wherein a steppedamount is equal to or less than a material thickness of the lead frame.23. The method of claim 19, wherein an inclination angle of the firstreflection portion to the mounting portion is from about 30 to about 60degrees.
 24. The method of claim 23, wherein a height of the firstreflection portion is from about 0.5 to about 1.5 times a materialthickness of the lead frame.
 25. The method of claim 23, wherein alength of the first reflection portion in the first direction is longerthan a length of the light-emitting device chip.